Packaged PIN Diodes

M/A-COM Tech’s broad line of packaged PIN diodes encompass a comprehensive range of electrical characteristics and package outlines. This diverse union of semiconductor technology and chip packaging gives considerable flexibility to the circuit designer. The fast switching of Packaged PIN Diodes utilize a thin I-region, silicon oxide or glass passivated chip which provides for low leakage current and low insertion loss. With the use of in process control monitors to regulate wafer fabrication parameters, these devices will achieve consistent performance in control circuit applications. The high voltage product line of Packaged PIN Diodes employs M/A-COM Tech's CERMACHIP? passivation process which provides for a hard glass encapsulation that hermetically seals and protects the active area of the chip. These packaged CERMACHIP? PIN diodes are ideally suited for use in high power applications where high level RF voltages are present. The diode chips are bonded into sealed ceramic packages that are designed for the most stringent electrical and environmental conditions. An extensive choice of package styles are available which may be used in a wide variety of RF microwave circuits. The Packaged PIN Diodes are designed to have a high inherent reliability and may be ordered screened to meet many MIL-STD requirements.

技术特性 Features
  • High Power
  • Fast Speed
  • Voltage Ratings to 1500 Volts
  • Wide Selection of Carrier Lifetimes
  • Wide Selection of Capacitances
  • Assortment of Packages Styles
  • Available Screened for Military Applications
  • RoHS Compliant
订购信息 Ordering Information
  • MA4P202
  • MA4P203
  • MA4P303
  • MA47047
  • MA47600
  • MA4P404
  • MA4P505
  • MA4P606
  • MA4P607
  • MA4P709
  • MADP000015-000030
  • MA4PH235
  • MA4PH236
  • MA4PH237
  • MA4PH238
  • MA4PH239
  • MADP-000234

应用技术支撑与电子电路设计开发资源下载 版本信息 大小
Packaged_PIN_Diodes 数据资料DataSheet下载.pdf Rev.V2 2 页
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